HeatDesigner

Heatdesigner è il software CFD basato su scSTREAM ed è una specializzazione per il thermal management ed il thermal design dei prodotti nel settore Electronics - infatti, HeatDesigner rende disponibili all'utente le funzioni specifiche per il thermal design con una interfaccia utente adattata ai prodotti Electronics. HeatDesigner è caratterizzato da performance di calcolo inarrivabili.

Heatdesigner è il software CFD basato su scSTREAM ed è una specializzazione per il thermal management ed il thermal design dei prodotti nel settore Electronics - infatti, HeatDesigner rende disponibili all'utente le funzioni specifiche per il thermal design con una interfaccia utente adattata ai prodotti Electronics. HeatDesigner è caratterizzato da performance di calcolo inarrivabili.

The Delphi model (multiple-resistor model) enables highly accurate calculation.

Parametric Study Tool is useful to apply multiple conditions to multiple parts and compare the analysis results. The tool automatically performs calculation the required number of times only by specifying the number of conditions and the parameters of the conditions. Multiple analysis results of different conditions can be obtained easily by setting parameters simply at the early stage. In addition, the tool can reduce human errors, which tend to be caused when multiple models are created.

Complicated conditions including trigonometric functions and conditional branches such as IF statements can be set without compiling.

The shapes and conditions of frequently used parts can be registered. Conditions include the allocation position, material, and heat generation.

The performance characteristics of a Peltier-device model can be considered for calculation.

P-Q characteristics and swirling components can be considered for calculation without creating the shape of a fan.

The pressure loss of a part can be considered for calculation only by setting its opening ratio.

Heat transfer from a heat source to a heat-releasing part by using a heat pipe is modeled and the model can be used for calculation.

The shapes of pin fins and plate fins can be created easily by specifying parameters.

The information on temperature of each part and a comprehensive amount of heat release obtained in post-processing of a general CFD analysis is not enough to know the heat path. HeatPathView displays heat paths and the amount of heat transfer in the whole computational domain in a diagram, a graph, and a table, allowing you to find the bottleneck of the heat paths easily.

The tool is provided free of charge (partially optional). The tool can create detailed models of semiconductor packages including QFP, SOP, and BGA by specifying parameters, and simplified models using thermal resistor models such as Delphi models and two-resistor models. Manufacturers of semiconductor packages can provide the data of semiconductor packages as thermal resistor models without releasing the inside information.

To calculate heat transfer conditions depending on wiring patterns of a printed circuit board (PCB) in detail, the module can read Gerber data output from an electric CAD tool and import the data as a model for a thermo-fluid analysis. By using Gerber data, a more realistic calculation result can be obtained with the consideration of heat transfer affected by an uneven wiring pattern.

By setting temperature difference and emissivity between objects, heat transfer by radiation of infrared rays, for example, can be considered. VF (view factor) method and FLUX method can be used. Transmission, absorption, and reflection of radiant rays can also be considered. The directivity of radiant rays can also be considered in FLUX method.

In structured mesh, even a complicated model does not need to be modified almost at all and the shape or the scale of a model does not affect the difficulty of mesh generation. In addition, Solver performs a calculation at a high speed in parallel computing and achieves effective processing as the speed increases depending on the number of subdomains.